Team 7 Semiconductor Research
This page will hold our progress as well as providing updates as we go along. As well, our posted schedule of work is presented in the form of a Gantt chart below.
This chart shows the schedule the group will follow starting on January 1st and going to May of 2022. The first objective that needs to be completed to maintain the critical path is to perform the Low Endurance Testing on our fabricated devices. The milestone (indicated by the light blue diamond) is the last day that this testing can be done to maintain our schedule. Once LEC is completed, we will need to evaluate our results and either begin our second-level testing or reconfigure our fabrication methods and redo the first-level testing. Once we make this decision we will work on this subtask, the last day we can work on either of these subtasks can be seen by the teal or purple diamond. We will then move on to device characterization, this process is essential to project completion and will be completed by the milestone represented via the green diamond. Once this process is completed we will then begin preparing our materials and data to present. We will work on our presentation and documentation at this time as well. All work must be completed by the final milestone as indicated by the dark blue diamond.
The above graphs demonstate a collective view of data we have gathered thus far on our ITO/WOx/ITO devices.
We have concluded LEC for our initial round of devices and from that, we decided we needed to fabricate and test new devices. We are entering the final round of LEC testing for our newly fabricated devices that have an ITO/WOx/ITO structure and have seen much better results from these devices. These findings have enabled up to move on to the fabrication of flexible memory using this new structure, meeting our applications requirements. As well, preliminary characterizations have begun to be made. As of now, we are on track to meet the goals set forth by the Gantt Chart shown above.
We have reached the end of scheduled time for fabrication and testing. By the end of Febuary it was determined that our Nickel/Wox devices were not viable and therefore we moved on to fabrication of new devices.By March 15th all ITO devices have been fabricated and tested and results analyized. These results have been fully compiled and presented at the undergraduate research symposium. Due to depostion machine complications we were unable to fully fabricate the flexible memeory devices in time for presentation, but we have fully designed the device fabrication and testing plan for these devices. We finished all presentation materials on time and are currently working on final documentation. Be sure to check out the documentation page for a full report of our work and detailed outline of how to recreate our results.
The above graphic shows our planned testing efforts given the entire project architecture. As this is a research project, most of our effort is in testing. Furthermore, most of our testing is contained within the Low Endurance Cycling procedure. This is where we verify device efficiency and is a pivotal point in deciding what the next step of the project is. As shown above, we have three documented tests at this step. The first test to be completed for any newly fabricated device is a memory cycling test. This test will provide insight into whether the devices are working properly and provide yield information. We have performed that test for both our Ni/WOx/Ni devices as well as our ITO/WOx/ITO devices. Once the devices prove to work with sufficient yield we can move on to the Memory Cycling test. This test provides insight into the performance of working devices and gives the necessary LEC data. To properly characterize our devices and provide the real insight we must also perform testing at the characterization step. One of these tests is the UV-Visible Spectroscopy test, which is to be performed on our ITO/WOx/ITO devices, as they had previously passed the LEC testing requirements. This level of testing will provide advanced insight into the fabricated devices.
