Reduced Profile Electronics Packaging
Problem Statement
Orbital Sciences Corporation (OSC), Launch Systems Group (LSG) has requested a redesign for their avionics control housing. Particular vehicle designs require a housing that will have less head height to mount in smaller areas. We propose to design a new module assembly and new module housing as needed to fulfill the requirements.
Requirements
Below is a list of the requirements communicated to us through Orbital. The first set includes the manditory attributes of the finished design. The second set (indented) outlines optimizations that are not crucial to the functionality of the design, but are desired to be optimized to create a more flexible and robust product.
- Utilize existing printed wiring board (PWB) board layout
- Accommodate six modules each with two PWB's
- The overall height of the entire unit must be less than five inches
- Unit footprint shall be optimized
- I/O connector locations (desirable to have all on one face)
- Board and unit resonant frequencies
- Minimum safety factor of 1.4
- Thermal conduction paths, thermal resistance
- Unit mass
- Manufacturability
- Minimize cost
